Hypertec A6993170-HY (Legacy) memory module 2 GB DDR3 1600 MHz ECC SDR SDRAM 2 V Memory ranking 2

2 V Memory ranking 2 ECC No Memory clock speed 2400 MHz Internal memory type DDR4 Weight & dimensions Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Packaging data Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g

The Kingston KCP432SD8/16 is a 16 GB memory module designed to meet the demands of modern computing

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3

2 V Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for PC/server Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3L Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for PC/server Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3L

Hypertec A6993170-HY (Legacy) memory module 2 GB DDR3 1600 MHz ECC SDR SDRAM 2 V Memory ranking 2A Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to