2 V Design Cooling type Heatsink Technical details Cooling type Heatsink Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 22 Memory voltage 1
Memory Buffered memory type Unregistered (unbuffered) Internal memory 2 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 2 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3
2 V Memory ranking 1 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Weight & dimensions Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Packaging data Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Other features Chips organisation 1Rx8
Intel® XMP-ready and XMP Certified in kit capacities of up to 64GB
Memory Buffered memory type Registered (buffered) Internal memory 16 GB Memory form factor 240-pin DIMM Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 16 GB Memory form factor 240-pin DIMM Internal memory type DDR3
Hypertec KN.4GB0H.001-HY memory module 4 GB DDR3 1333 MHz DDR3 2 V Design Cooling typeMemory Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 240 pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 240 pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3