Hypertec 256MB PC100 (Legacy) memory module 0.25 GB 1 x 0.25 GB SDR SDRAM DDR3 Hypertec has spent over 20

Hypertec has spent over 20 years as a leading figure in the IT industry and working with the top resellers

Memory Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM Memory clock speed 1600 MHz Internal memory type DDR3 Features Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM Memory clock speed 1600 MHz Internal memory type DDR3

2 V Design Backlight No Technical details Chips organisation 2Rx4 Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Server Memory form factor 288-pin DIMM CAS latency 19 Memory voltage 1

1 V Memory ranking 1 ECC No Memory clock speed 4800 MHz Internal memory type DDR5 Features Buffered memory type Unregistered (unbuffered) Backlight No Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC Memory form factor 288-pin DIMM CAS latency 40 Memory voltage 1

Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC/server Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC/server Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3

Hypertec 256MB PC100 (Legacy) memory module 0.25 GB 1 x 0.25 GB SDR SDRAM DDR3 Hypertec has spent over 20A Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to