Hypertec HYR25351248GBOE (Legacy) memory module 8 GB 1 x 8 GB DDR2 667 MHz ECC DDR4 A Dell equivalent 1600mhz 8GB

A Dell equivalent 1600mhz 8GB SODIMM (PC3-12800)

A Hewlett Packard Enterprise equivalent 16 GB Dual rank- registered ECC DDR4 SDRAM - DIMM 288-pin 2666 MHz (PC4-21300) from Hypertec NOTE: This memory meets the memory specification requirements for reliable operation within a HP Generation 8 (or 9) server- but is not SmartMemory and does not identify as SmartMemory when installed or deliver SmartMemory specific features

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3

TruDDR4 Memory uses the highest quality components that are sourced from Tier 1 DRAM suppliers and only memory that meets the strict requirements of Lenovo is selected

Hypertec HYR25351248GBOE (Legacy) memory module 8 GB 1 x 8 GB DDR2 667 MHz ECC DDR4 A Dell equivalent 1600mhz 8GBA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to