Hypertec TC.33100.029-HY (Legacy) memory module 2 GB DDR3 1333 MHz ECC DDR4 2 V Design Cooling type

2 V Design Cooling type Heatsink Technical details Cooling type Heatsink Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 21 Memory voltage 1

35 V Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM CAS latency 9 Memory voltage 1

Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3

2 V Memory ranking 1 ECC Yes Memory clock speed 2400 MHz Internal memory type DDR4 Weight & dimensions Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Packaging data Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Other features Chips organisation 1Rx8

35 V Memory ranking 4 ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3L

Hypertec TC.33100.029-HY (Legacy) memory module 2 GB DDR3 1333 MHz ECC DDR4 2 V Design Cooling typeA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to