HPE RP001231017 memory module 16 GB DDR3 1600 MHz Form factor___Rack Japan HP segment Enterprise Operational

Japan HP segment Enterprise Operational conditions Storage temperature (T-T) -20 - 40 °C Operating relative humidity (H-H) 20 - 80% Operating temperature (T-T) 15 - 25 °C Weight & dimensions Width 385 mm Depth 109 mm Height 125 mm Weight 720 g Package width 385 mm Package depth 109 mm Package height 125 mm Package weight 900 g Brand-specific features HP GTIN (EAN/UPC) 884962772355 Technical details Master (outer) cases per pallet layer (EU) 21 pc(s) Maximum number of stacking cartons 36 pc(s) Box contents Toner cartridge

4a Ethernet LAN (RJ-45) ports 1 Combo headphone/mic port Yes DC-in jack Yes Number of front audio ports 1 Number of front USB ports 2 Number of rear USB ports 4 Design Chassis type Micro PC Placement supported Horizontal/Vertical Cable lock slot Yes Cable lock slot type Kensington Product colour Black Intel® vPro™ Platform Eligibility Yes Performance Product type Mini PC Market positioning Business Motherboard chipset Intel® Q870 Audio chip Realtek ALC3204 Audio system High Definition Audio Trusted Platform Module (TPM) version 2

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HPE RP001231017 memory module 16 GB DDR3 1600 MHz Form factor___Rack Japan HP segment Enterprise Operational16GB, DDR3, 240 pin DIMM **Refurbished** Features Memory form factor 240 pin DIMM Component for PC Server Memory clock speed 1600 MHz Internal memory type DDR3 Internal memory 16 GB